Reliability, Machine Learning And Advanced Packaging

Reliability, Machine Learning And Advanced Packaging

Source: Ed Sperling, Semiconductor Engineering

Experts at the Table, part 1: The biggest concerns in chip design and how new markets and technologies are affecting them.

Semiconductor Engineering sat down to discuss reliability, resilience, machine learning and advanced packaging with Rahul Goyal, vice president in the technology and manufacturing group at Intel; Rob Aitken, R&D fellow at Arm; John Lee, vice president and general manager of the semiconductor business unit at ANSYS; and Lluis Paris, director of IP portfolio marketing at TSMC. What follows are excerpts of that conversation. Read entire article…

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